(San Diego, CA USA), March 26, 2024 - Accelink has announced their successful collaboration with Cisco on a 1.6T OSFP-XD silicon photonics-based transceiver. Leveraging the strengths of both industry leaders, this marks a significant leap forward in silicon photonic based optical module technology, enabling higher speeds in data centers for cloud and Artificial Intelligence (AI) applications.
3月26日，光迅科技联合思科成功推出1.6T OSFP-XD硅光模块。双方强强联手，标志着基于硅光的光模块技术取得重大飞跃，以推动云和人工智能（AI）应用的数据中心实现更高的传输速率。

Cisco, with its extensive experience in silicon photonics Photonic Integrated Circuits (PICs), has joined forces with Accelink, a global leader in the design and manufacturing of high-speed optical modules. This partnership leverages Cisco's proven ability to scale coherent silicon photonics for data center volumes with Accelink's unparalleled capabilities in optical module innovation. Together, they have spearheaded the development of this 1.6T OSFP-XD silicon photonic-based transceiver, demonstrating an unmatched level of innovation and commitment.
思科凭借其在硅光子集成电路（PIC）方面的丰富经验，与全球高速光模块研发和制造先行者—光迅科技强强联手。这次战略合作展现了思科为数据中心容量扩展相干硅光技术的能力，以及光迅科技在光模块技术的创新能力。双方携手率先开发的1.6T OSFP-XD硅光模块，展示了其领先的创新水平。

Figure1. 1.6T OSFP-XD silicon photonic-based transceiver

“In collaboration with Cisco, Accelink is delighted to contribute to pushing data transmission boundaries through our joint expertise in Cisco’s silicon photonics” said Dr. Ethan Hu, CEO of Accelink. “We extend our heartfelt gratitude to Cisco for their invaluable partnership, which has enabled us to achieve a pinnacle of achievement in high-speed interconnectivity, paving the way for seamless adoption of emerging applications such as AI and ML in diverse networking environments.”
光迅科技总经理胡强高博士表示：“我们很高兴与思科合作，通过光迅科技和思科在硅光方面的专业知识，为突破数据传输边界做出贡献。”“我们也衷心感谢思科宝贵的合作伙伴关系，使我们在高速互联方面处于领先地位，为在各种网络环境中无缝采用人工智能和机器学习等新兴应用铺平道路。”

The 1.6T OSFP-XD DR8 silicon photonics transceiver represents a major technological milestone, featuring advanced CMOS technology for highly integrated, simplified packaging and mass production. Meeting the rigorous OSFP-XD MSA and CMIS protocol standards, the module boasts an electrical interface with 16 channels at a 100Gb/s signal rate each, alongside an optical interface with 8 channels at a 200Gb/s signal rate each, achieving a transmission distance of 500m with exceptional margin and efficiency. This silicon photonics-based transceiver provides high-speed interconnectivity in areas such as data centers and cloud computing due to its ultra-high transmission rate and reliability.
1.6T OSFP-XD DR8硅光模块是一个重要的技术里程碑，采用先进的CMOS技术实现高度集成、简化封装和大规模生产。该模块符合严格的OSFP-XD MSA和CMIS协议标准，电接口采用16个通道，单通道信号速率100Gb/s；光接口采用8通道，单通道信号速率200Gb/s，以优异的裕度和效率实现了距离500米的数据传输。这种基于硅光的光收发模块因其超高的传输速率和可靠性，可在数据中心和云计算等领域实现高速互连。

Figure2. Transmitter Eye Diagram of the 1.6T OSFP-XD Transceiver

“We are thrilled to collaborate with the team at Accelink to bring advanced optical solutions to market,” said Tom Williams, Senior Director of Marketing for Cisco. “We believe our high-performing silicon photonics that can be manufactured in high volume will play an important role in building next generation networks for AI infrastructures.”
思科市场营销高级总监Tom Williams表示：“我们很高兴能与光迅科技合作，将先进的光学解决方案推向市场。”“我们相信，我们推出的可以大批量生产的高性能硅光产品将在构建下一代人工智能基础设施网络方面发挥重要作用。”

Accelink will demonstrate this innovative product at the OFC (Optical Communication Conference) in in San Diego, March 24-28 at Booth# 2247. This collaboration not only demonstrates Cisco’s global leadership and influence in silicon photonics PIC technology but also confirms Accelink’s leading position in the optical transceiver market. Both companies see opportunities for further collaboration to solve the needs of network operators for reliable high-speed optical technology.
光迅科将于3月26日至28日在圣地亚哥举行的OFC（展位号2247）展示这一创新产品。此次合作不仅展示了思科在硅光PIC技术方面的全球领导力和影响力，也证实了光迅科技在光收发模块市场的领先地位。双方将进一步紧密合作，共同满足网络运营商对可靠高速光学技术的需求。